International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging


Comments summarized

Comments received
No comments
No response
P-members 4 5 0
O-members 0 8 10
Total 4 13 10

 Illustration: Voting

Report of Comments

Document 47D/920/DC


Proposal from the Japanese National Committee for a future Technical Report, “Thermal management of semiconductor packages” – Call for comments/proposals


Reference Circulation date Closing date Downloads
47D/920/DC 2020-05-08 2020-06-19
Compilation of Comments
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All comments

Austria P 2020-06-18 N
Belarus O 2020-06-15 N
Belgium P 2020-06-19 N
China P 2020-06-08 Y
Czech Republic O
Denmark O
Finland O 2020-06-11 N
France O 2020-06-17 N
Germany P 2020-06-18 Y
Iran O 2020-06-16 N
Italy O 2020-06-16 N
Japan P 2020-06-19 Y
Korea, Republic of P 2020-06-15 N
Netherlands O
Pakistan P 2020-06-19 N
Poland O
Portugal O 2020-06-19 N
Romania O
Russian Federation O 2020-06-19 N
Singapore P 2020-05-12 N
Spain O
Sweden O
Switzerland O
Thailand O
Ukraine O
United Kingdom O 2020-06-02 N
United States of America P 2020-06-19 Y