International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Comments summarized

Comments received
No comments
No response
P-members 3 5 0
O-members 0 8 11
Total 3 13 11


 Illustration: Voting

Report of Comments

Document 47D/917/DC

 

Proposal from the Korean National Committee for a future Technical Report, “Standardization Roadmap for Fan-Out Packages” – Call for comments/proposals

 

Reference Circulation date Closing date Downloads
47D/917/DC 2019-11-29 2020-01-24
Compilation of Comments
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All comments

Country
Status
Received
Comments
Austria O 2020-01-23 N
Belarus O 2020-01-24 N
Belgium P 2020-01-24 N
China P 2020-01-13 N
Czech Republic O
Denmark O
Finland O 2019-12-02 N
France O 2020-01-23 N
Germany P 2020-01-24 Y
Iran O
Italy O
Japan P 2020-01-20 Y
Korea, Republic of P 2020-01-24 N
Netherlands O
Pakistan P 2020-01-23 N
Poland O
Portugal O 2020-01-24 N
Romania O 2020-01-23 N
Russian Federation O 2020-01-24 N
Singapore P 2019-12-06 N
Spain O
Sweden O
Switzerland O
Thailand O
Ukraine O
United Kingdom O 2020-01-16 N
United States of America P 2020-01-24 Y