TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 2 8 1
O-members 0 4 16
Non-members 0 2 0
Total 2 14 17

P-members with no response: Netherlands

*Comments not included in the compiled table, available as a separate file, because they were not submitted using the template Form-Comments.

 Illustration: Voting

Report of Comments

Document 91/1700/CD


Project : IEC 61188-6-3 ED1

IEC 61188-6-3 ED1: Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)


Reference Circulation date Closing date Downloads
91/1700/CD 2021-01-01 2021-03-26
Compilation of Comments
CC file    
export to xls file

All comments

Austria O 2021-03-24 N
Belgium O 2021-03-26 N
Brazil O
Bulgaria O
China P 2021-03-15 N
Czech Republic O
Denmark O
Finland P 2021-03-11 N
France O 2021-03-24 N
Germany P 2021-03-22 N
Greece - 2021-03-26 N
Hungary O
India P 2021-03-21 N
Israel O
Italy P 2021-03-18 Y
Japan P 2021-03-10 Y
Korea, Republic of P 2021-03-26 N
Netherlands P
Norway O
Poland O
Portugal O 2021-03-25 N
Romania O
Russian Federation P 2021-03-26 N
Serbia O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Arab Emirates - 2021-03-25 N
United Kingdom P 2021-03-02 N
United States of America P 2021-03-25 N