TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 3 7 1
O-members 0 5 15
Non-members 0 1 0
Total 3 13 16

P-members with no response: Netherlands

*Comments not included in the compiled table, available as a separate file, because they were not submitted using the template Form-Comments.

 Illustration: Voting

Report of Comments

Document 91/1691/DC


Call for comments on proposed Technical Report on “SURFACE MOUNTING TECHNOLOGY – Part X: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method”


Reference Circulation date Closing date Downloads
91/1691/DC 2020-12-04 2021-01-15
Compilation of Comments
CC file    
export to xls file

All comments

Austria O 2021-01-14 N
Belgium O 2021-01-15 N
Brazil O 2021-01-15 N
Bulgaria O
China P 2021-01-04 N
Czech Republic O
Denmark O
Finland P 2020-12-14 N
France O 2021-01-13 N
Germany P 2021-01-13 Y
Hungary O
India P 2021-01-15 N
Israel O
Italy P 2021-01-11 Y
Japan P 2021-01-05 N
Korea, Republic of P 2021-01-15 N
Netherlands P
Norway O
Poland O
Portugal O 2021-01-15 N
Romania O
Russian Federation P 2021-01-15 N
Serbia O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Arab Emirates - 2021-01-14 N
United Kingdom P 2021-01-07 Y
United States of America P 2021-01-14 N