TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 2 8 1
O-members 0 4 16
Non-members 0 3 0
Total 2 15 17

P-members with no response: Netherlands

*Comments not included in the compiled table, available as a separate file, because they were not submitted using the template Form-Comments.

 Illustration: Voting

Report of Comments

Document 91/1690/CD


Project : IEC 61189-2-808 ED1

IEC 61189-2-808 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method


Reference Circulation date Closing date Downloads
91/1690/CD 2020-12-04 2021-02-26
Compilation of Comments
CC file    
export to xls file

All comments

Austria O 2021-02-24 N
Belgium O 2021-02-26 N
Brazil O
Bulgaria O
China P 2021-02-15 N
Czech Republic O
Democratic People's Republic of Korea - 2021-02-22 N
Denmark O
Finland P 2020-12-14 Y
France O 2021-02-22 N
Germany P 2021-02-25 Y
Greece - 2021-02-26 N
Hungary O
India P 2021-02-16 N
Israel O
Italy P 2021-02-22 N
Japan P 2021-02-25 N
Korea, Republic of P 2021-02-26 N
Netherlands P
Norway O
Poland O
Portugal O 2021-02-26 N
Romania O
Russian Federation P 2021-02-26 N
Serbia O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Arab Emirates - 2021-02-24 N
United Kingdom P 2021-02-04 N
United States of America P 2021-02-25 N