International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 3 7 1
O-members 0 5 15
Non-members 0 1 0
Total 3 13 16

P-members with no response: Netherlands

*Comments not included in the compiled table, available as a separate file, because they were not submitted using the template Form-Comments.

 Illustration: Voting

Report of Comments

Document 91/1647/CD


Project : IEC 61189-2-807 ED1

IEC 61189-2-807 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA


Reference Circulation date Closing date Downloads
91/1647/CD 2020-04-17 2020-06-12
Compilation of Comments
CC file    
export to xls file

All comments

Austria O 2020-06-10 N
Belgium O 2020-06-12 N
Brazil O 2020-06-12 N
Bulgaria O
China P 2020-06-01 N
Czech Republic O
Denmark O
Finland P 2020-06-08 N
France O 2020-06-11 N
Germany P 2020-05-15 Y
Greece - 2020-06-12 N
Hungary O
India P 2020-06-11 N
Israel O
Italy P 2020-06-10 N
Japan P 2020-06-08 N
Korea, Republic of P 2020-06-12 N
Netherlands P
Norway O
Poland O
Portugal O 2020-06-12 N
Romania O
Russian Federation P 2020-06-12 N
Serbia O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2020-05-26 Y
United States of America P 2020-06-12 Y