International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 1 9 1
O-members 0 5 15
Non-members 0 2 0
Total 1 16 16

P-members with no response: Netherlands

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 91/1620/CD


Project : IEC 61189-5-301 ED1

IEC 61189-5-301 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles


Reference Circulation date Closing date Downloads
91/1620/CD 2019-11-08 2020-01-31
Compilation of Comments
CC file    
export to xls file

All comments

Austria O 2020-01-30 N
Belgium O 2020-01-31 N
Brazil O 2020-01-31 N
Bulgaria O
China P 2020-01-19 N
Czech Republic O
Denmark O
Finland P 2020-01-28 N
France O 2020-01-29 N
Germany P 2020-01-31 N
Greece - 2020-01-30 N
Hungary O
India P 2020-01-24 N
Israel O
Italy P 2020-01-30 N
Japan P 2020-01-21 N
Korea, Republic of P 2020-01-31 N
Netherlands P
Norway O
Poland O
Portugal O 2020-01-31 N
Romania O
Russian Federation P 2020-01-31 N
Serbia O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Arab Emirates - 2020-01-29 N
United Kingdom P 2020-01-16 Y
United States of America P 2020-01-31 N