International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 3 8 0
O-members 0 6 14
Total 3 14 14

 Illustration: Voting

Report of Comments

Document 91/1604/CD


Project : IEC 61188-6-2 ED1

IEC 61188-6-2 ED1: Printed boards and printed board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)


Reference Circulation date Closing date Downloads
91/1604/CD 2019-08-02 2019-09-27
Compilation of Comments
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All comments

Austria O 2019-09-27 N
Belgium O 2019-09-27 N
Brazil O 2019-09-27 N
Bulgaria O
China P 2019-09-16 N
Czech Republic O
Denmark O
Finland P 2019-09-24 N
France O 2019-09-26 N
Germany P 2019-09-25 Y
Hungary O
India P 2019-09-17 N
Israel O
Italy P 2019-09-25 N
Japan P 2019-09-20 Y
Korea, Republic of P 2019-09-27 N
Netherlands P 2019-09-20 N
Norway O
Poland O
Portugal O 2019-09-27 N
Romania O 2019-09-27 N
Russian Federation P 2019-09-26 N
Serbia O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2019-09-04 Y
United States of America P 2019-09-25 N