International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Comments summarized

Comments received
No comments
No response
P-members 3 8 0
O-members 0 6 14
Non-members 0 1 0
Total 3 15 14


 Illustration: Voting

Report of Comments

Document 91/1588/CD

 

Project : IEC 61760-3 ED2

IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

 

Reference Circulation date Closing date Downloads
91/1588/CD 2019-07-12 2019-09-06
Compilation of Comments
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All comments

Country
Status
Received
Comments
Austria O 2019-09-06 N
Belgium O 2019-09-06 N
Brazil O 2019-09-06 N
Bulgaria O
China P 2019-08-26 N
Czech Republic O
Denmark O
Finland P 2019-09-02 N
France O 2019-09-06 N
Germany P 2019-09-04 Y
Greece - 2019-09-06 N
Hungary O
India P 2019-09-06 N
Israel O
Italy P 2019-09-04 N
Japan P 2019-09-02 Y
Korea, Republic of P 2019-09-06 N
Netherlands P 2019-09-05 N
Norway O
Poland O
Portugal O 2019-09-06 N
Romania O 2019-09-06 N
Russian Federation P 2019-09-05 N
Serbia O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2019-08-30 Y
United States of America P 2019-09-04 N