International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 3 8 0
O-members 0 6 14
Non-members 0 2 0
Total 3 16 14

 Illustration: Voting

Report of Comments

Document 91/1569/CD


Project : IEC 61189-5-501 ED1

IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes


Reference Circulation date Closing date Downloads
91/1569/CD 2019-04-05 2019-06-28
Compilation of Comments
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All comments

Austria O 2019-06-27 N
Belgium O 2019-06-28 N
Brazil O 2019-06-28 N
Bulgaria O
China P 2019-06-17 N
Czech Republic O
Denmark O
Finland P 2019-05-23 Y
France O 2019-06-27 N
Germany P 2019-06-10 Y
Greece - 2019-06-28 N
Hungary O
India P 2019-06-26 N
Israel O
Italy P 2019-06-26 N
Japan P 2019-06-25 Y
Korea, Republic of P 2019-06-28 N
Netherlands P 2019-06-21 N
Norway O
Poland O
Portugal O 2019-06-21 N
Romania O 2019-06-28 N
Russian Federation P 2019-06-27 N
Serbia O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Arab Emirates - 2019-06-27 N
United Kingdom P 2019-06-20 N
United States of America P 2019-06-27 N