TC 47

Semiconductor devices

 

P-Members vote

P-Members

Voting
P-Members

In favour
In favour %
Criteria
Result
8 8 100 >=66.7% APPROVED

All Votes

Total

Votes Cast
Total

Against
Against %
Criteria
Result
11 0 0 <=25% APPROVED

 Illustration: Voting

Voting Result

APPROVED

Document 47/2634(F)/FDIS

 

Project : IEC 60749-20:2020 ED3

IEC 60749-20 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

 

Reference Circulation date Closing date Downloads
47/2634(F)/FDIS 2020-06-19 2020-07-10

Compilation of Comments
CC file    
 
export to xls file

Result of Voting

Country
Status
Received
Vote
Comments
Austria P 2020-07-03 Y -
Belarus O 2020-07-07 Y -
Belgium P 2020-07-07 A -
Brazil O 2020-07-10 A -
Bulgaria O -
China P 2020-06-28 Y -
Czech Republic O -
Denmark O -
Finland O 2020-06-01 A -
France P 2020-06-23 A -
Germany P 2020-07-01 Y -
Greece - 2020-07-10 A -
Hungary O -
India O 2020-07-10 A -
Iran O -
Ireland O -
Israel P 2020-07-09 A -
Italy P 2020-07-09 Y -
Japan P 2020-07-07 Y -
Korea, Republic of P 2020-07-10 Y -
Netherlands P 2020-07-10 A -
Norway O -
Pakistan P -
Philippines, Rep. of the O -
Poland O 2020-07-06 Y -
Portugal - 2020-07-10 A -
Qatar - 2020-07-09 Y -
Romania O 2020-07-03 A -
Russian Federation P 2020-07-10 Y -
Serbia O -
Singapore P 2020-06-11 A -
Spain O -
Sweden O -
Switzerland O 2020-06-11 A -
Thailand O -
Turkey O -
Ukraine O -
United Kingdom P 2020-06-30 Y -
United States of America P 2020-07-10 A -

NOTES:



  1. Vote: Does the National Committee agree to publish the FDIS as an International Standard?
    Y = In favour; N = Against; A = Abstention.

  2. Abstentions are not taken into account when totalizing the votes.

  3. P-members not voting: Pakistan (1).


*Comments not included in the compiled table, available as a separate file, because they were not submitted using the template Form-Comments.