International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10 MERGED  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
52(US)/126/NWP  
1991-05-24 
ANW
52(SEC.)/351/RVN  
1991-09-15 
1CD
52(SEC.)/480/CD  
1994-03-18 
ACDV
52/537/CC  
1995-02-03 
MERGED
1995-07-07 
  

Project

IEC 61189-3/AMD1/FRAG7 ED1

Test methods for interconnection structures (printed boards) - Test N05: Thermal shock, floating, solder bath 280°C