International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 Kaichi TsurutaDELPUB2010-06 

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/808/MCR PDF file 88 kB
2008-08-29 
1CD
91/809/CD PDF file 229 kB
2008-09-052008-09
ACDV
91/839/CC PDF file 175 kB
2009-01-092009-01
CCDV
91/847/CDV PDF file 153 kB
PDF file 178 kB
2009-02-062009-01
CCDV
91/847F/CDV PDF file 178 kB
2009-03-272009-03
AFDIS
91/899/RVC PDF file 218 kB
2009-10-302009-10
DECFDIS
2010-02-082009-11
RFDIS
2010-02-162010-02
CFDIS
91/920/FDIS

2010-03-122010-05
APUB
91/925/RVD PDF file 211 kB
2010-05-172010-05
BPUB
2010-05-182010-05
PPUB
2010-06-102010-06
DELPUB
2017-12-13 
WPUB
  

Project

IEC 61190-1-3:2007/AMD1:2010 ED2

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications