International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 T KoizumiWPUB2007-05 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/616/NP PDF file 594 kB
2006-07-21 
ANW
91/644/RVN PDF file 137 kB
2007-01-262006-12
DECPUB
2007-02-012007-02
BPUB
2007-02-272007-02
RPUB
2007-05-10 
PPUB
2007-05-302007-05
WPUB
91/1237/RR PDF file 21 kB
2015-01-09 
  

Project

IEC PAS 61249-3-1:2007 ED1

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)