International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 Toru KOIZUMICAN2011-01 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/616/NP PDF file 594 kB
2006-07-21 
ANW
91/644/RVN PDF file 137 kB
2007-01-262006-12
1CD
91/752/CD PDF file 436 kB
2008-02-152007-12
CDM
91/818/CC Word file 118 kB
PDF file 120 kB
2008-09-192008-06
CDM
91/818A/CC Word file 105 kB
PDF file 215 kB
2009-08-21 
ACDV
91/818B/CC PDF file 214 kB
2010-01-222009-11
PWI
2012-01-122011-12
DEL
2013-10-11 
  

Project

IEC TS 61249-3-1 ED1

Materials for printed boards and other interconnecting structures - Copper-Clad Laminates for Flexible Boards (Adhesive and Non-adhesive types)

 

 

Associated Documents:

SMB/4630/DL

PDF file 266 kB
SMB/4536/DL

PDF file 273 kB
SMB/4343/DL

PDF file 280 kB
SMB/4204/DL

PDF file 187 kB