International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 Douglas SoberDEL  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/594/NP PDF file 426 kB
2006-04-28 
DEL
91/623/RVN PDF file 125 kB
2006-09-222006-09
  

Project

PNW 91-594 ED1

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly