International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91 MERGED 2007

History

Stage
Document
Downloads
Decision Date
Target Date
DECPUB
2004-09-22 
BPUB
2004-09-232004-09
RPUB
2004-12-02 
PPUB
2005-02-142004-11
MERGED
2005-02-14 
  

Abstract

This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.

Project

IEC 62137/FRAGf ED1

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN