Electronics assembly technology
|TC 91||DELPUB|| |
Gives information on the choice of solder and flux, temperature of test, ageing, as well as methods for the globule test, the solder bath test, the soldering iron test, solderability and de-wetting phenomena, resistance to soldering heat.
IEC 60068-2-44:1979 ED1
Basic environmental testing procedures - Part 2: Tests - Tests - Guidance on Test T: Soldering
Revised By - IEC 60068-2-44:1995 ED2