International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 D.J. SOBERPPUB2013-102020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/759/NP PDF file 185 kB
2008-03-07 
ANW
91/792/RVN PDF file 181 kB
2008-08-012008-07
1CD
91/951/CD PDF file 264 kB
2010-09-242010-03
ACDV
91/967/CC Word file 153 kB
PDF file 232 kB
2011-02-182010-12
CCDV
91/973/CDV PDF file 267 kB
PDF file 274 kB
2011-04-082011-04
AFDIS
91/1010A/RVC Word file 127 kB
PDF file 200 kB
2011-09-152011-12
DECFDIS
2013-06-242013-04
RFDIS
2013-07-012013-07
CFDIS
91/1126/FDIS

2013-07-312013-09
APUB
91/1148/RVD PDF file 55 kB
2013-10-072013-10
BPUB
2013-10-082013-10
PPUB
2013-11-042013-11
  

Project

IEC 61249-4-19:2013 ED1

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

 

 

Associated Documents:

SMB/4881/DL

PDF file 348 kB