International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |

Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
---|---|---|---|---|---|
TC 91 | WG 4 | PPUB |   | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
---|---|---|---|---|---|---|
PNW |
| 1993-07-01 | ||||
ANW |
| 1993-11-12 | ||||
1CD |
| 1995-06-23 | 1995-05 | |||
ACDV |
| 1995-11-24 | 1995-11 | |||
CCDV |
| 1996-06-07 | 1996-02 | |||
AFDIS |
| 1997-02-07 | 1997-03 | |||
DECFDIS | 1998-06-19 | 1997-07 | ||||
RFDIS | 1998-07-30 | 1998-07 | ||||
CFDIS |
| 1998-09-25 | 1998-10 | |||
APUB |
| 1998-12-03 | 1998-12 | |||
BPUB | 1998-12-04 | |||||
PPUB | 1999-01-29 | 1999-02 | ||||
Project
IEC 61249-2-12:1999 ED1
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Associated Documents:
52/744/RM
