International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 R. TaubeMERGED 2024

History

Stage
Document
Downloads
Decision Date
Target Date
DECPUB
2019-07-25 
RPUB
2019-08-12 
BPUB
2019-08-292019-11
MERGED
2019-09-252019-11
  

Abstract

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.

Project

IEC 61191-2/FRAGF ED3

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies