International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 47WG 2Mr Jim LynchPPUB2020-082025

History

Stage
Document
Downloads
Decision Date
Target Date
ACDV
47/2561/RR PDF file 91 kB
2019-04-01 
TCDV
2019-04-022019-05
CCDV
47/2563/CDV PDF file 766 kB
PDF file 675 kB

2019-05-242019-05
PRVC
47/2626/RVC PDF file 243 kB
Word file 41 kB
2019-08-162019-08
AFDIS
2020-04-142020-04
DECFDIS
2020-04-30 
RFDIS
2020-05-082020-05
CFDIS
47/2634/FDIS
2020-05-292020-07
CFDIS
47/2634(F)/FDIS
2020-05-292020-07
PRVD
2020-07-102020-07
APUB
47/2646/RVD PDF file 156 kB
2020-07-172020-07
BPUB
2020-07-172020-07
PPUB
2020-08-312020-08
  

Abstract

IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.

Project

IEC 60749-20:2020 ED3

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat