International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 2 Mr. Hirofumi NakajimaPPUB2012-122022

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/782/NP PDF file 471 kB
2010-08-27 
ANW
47D/801/RVN Word file 127 kB
PDF file 218 kB
2011-04-082011-01
1CD
47D/802/CD PDF file 652 kB
2011-05-272011-06
ACDV
47D/811A/CC Word file 90 kB
PDF file 139 kB
2011-09-142011-10
CCDV
47D/812/CDV PDF file 1546 kB
PDF file 1683 kB
2011-11-242011-12
APUB
47D/820/RVC Word file 93 kB
PDF file 119 kB
2012-05-182012-07
DECPUB
2012-10-052012-11
BPUB
2012-10-172012-10
RPUB
2012-11-05 
PPUB
2012-12-112013-02
  

Project

IEC 60191-6-22:2012 ED1

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)