International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | PPUB | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1991-06-28 | ||||
| ANW |
| 1991-10-15 | ||||
| 1CD |
| 1993-07-23 | ||||
| 2CD |
| 1994-08-19 | ||||
| ACDV |
| 1995-05-26 | 1994-12 | |||
| CCDV |
| 1996-02-02 | 1996-05 | |||
| AFDIS |
| 1996-09-27 | 1996-10 | |||
| DECFDIS | 1996-10-22 | 1997-01 | ||||
| RFDIS | 1996-12-13 | 1997-11 | ||||
| CFDIS |
| 1997-01-31 | 1997-04 | |||
| APUB |
| 1997-04-21 | 1997-04 | |||
| BPUB | 1997-04-22 | 1997-05 | ||||
| PPUB | 1997-06-24 | 1997-05 | ||||
Project
IEC 61249-8-8:1997 ED1
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings