International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | K. Ikeda | DEL | 2012-03 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2008-08-29 | ||||
| ANW |
| 2009-08-21 | 2009-01 | |||
| DEL | 2012-10-19 | 2012-08 | ||||
Project
IEC 61189-2-628 ED1
IEC 61189-2-628,Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis(DMA; bend and pull)
Associated Documents:
SMB/4536/DL
273 kB