International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91 MERGED  

History

Stage
Document
Downloads
Decision Date
Target Date
DECPUB
2019-07-24 
RPUB
2019-08-12 
BPUB
2019-08-232019-11
MERGED
2019-09-202019-10
  

Abstract

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

Project

IEC 61191-3/FRAGF ED2

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies