Electronics assembly technology
|TC 91||DELPUB|| |
Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.
IEC 60068-2-58:1989 ED1
Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
Revised By - IEC 60068-2-58:1999 ED2