International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | Tracy Cai | PPUB | 2015-05 | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2012-11-14 | ||||
| ANW |
| 2013-04-02 | 2013-03 | |||
| 1CD |
| 2013-07-09 | 2013-04 | |||
| ACDV |
| 2013-11-28 | 2013-10 | |||
| CCDV |
| 2014-05-09 | 2014-03 | |||
| AFDIS |
| 2014-09-05 | 2014-11 | |||
| DECFDIS | 2015-01-06 | 2014-12 | ||||
| RFDIS | 2015-01-22 | 2015-01 | ||||
| CFDIS |
| 2015-02-06 | 2015-04 | |||
| APUB |
| 2015-04-15 | 2015-04 | |||
| BPUB | 2015-04-16 | 2015-04 | ||||
| PPUB | 2015-04-29 | 2015-05 | ||||
286 kB
119 kBAbstract
IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
Project
IEC 61189-2-721:2015 ED1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator