International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 1 | WPUB |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW | 1989-11-01 | |||||
| ANW | 1989-11-16 | |||||
| 1CD |
| 1991-02-20 | ||||
| AFDIS | 1991-07-19 | |||||
| CFDIS |
| 1991-08-02 | ||||
| APUB |
| 1992-05-29 | ||||
| BPUB | 1992-10-13 | |||||
| PPUB | 1993-05-18 | |||||
| WPUB |
| 2004-10-15 | ||||
Project
IEC 60249-2-13:1987/AMD1:1993 ED1
Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
Associated Documents:
91/363/MCR
83 kB