International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | D.J. SOBER | PPUB | 2020 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2002-04-26 | ||||
| ANW |
| 2002-10-11 | 2002-09 | |||
| 1CD |
| 2002-10-11 | 2002-11 | |||
| ACDV |
| 2003-04-11 | 2003-02 | |||
| CCDV |
| 2003-08-29 | 2003-05 | |||
| AFDIS |
| 2004-05-21 | 2004-04 | |||
| DECFDIS | 2004-07-30 | 2004-08 | ||||
| RFDIS | 2004-08-03 | 2004-08 | ||||
| CFDIS |
| 2004-10-01 | 2004-11 | |||
| APUB |
| 2004-12-06 | 2005-02 | |||
| BPUB | 2004-12-07 | 2005-03 | ||||
| PPUB | 2005-01-11 | 2005-04 | ||||
112 kBProject
IEC 61249-2-26:2005 ED1
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad