International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91 D. BergmanWPUB  

History

Stage
Document
Downloads
Decision Date
Target Date
CDPAS
91/139/PAS  
1998-06-05 
APUB
91/153/RVD  
1998-08-191998-09
BPUB
1998-08-20 
PPUB
1998-12-031998-09
WPUB
91/480/MCR PDF file 94 kB
2004-10-292004-10
  

Abstract

Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect, Micro Ball Grid Array, Micro Surface Mount Technology and Slightly Larger than Integrated Circuit Carrier.

Project

IEC PAS 62084:1998 ED1

Implementation of flip chip and chip scale technology