International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 H. OkamotoMERGED 2022

History

Stage
Document
Downloads
Decision Date
Target Date
DECPUB
2019-07-31 
RPUB
2019-08-14 
BPUB
2019-08-202019-11
MERGED
2019-09-202019-10
  

Project

IEC 61189-5-503/FRAGF ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards