International Standards and Conformity Assessment for all electrical, electronic and related technologies
Electronics assembly technology
|TC 91||WG 12||Mr Hiroyuki ISHIBASHI||CD||2021-12|
IEC 61188-6-2 ED1
Circuit boards and circuit boards assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Project title has been changed from “Printed boards and printed boards assemblies“ to “Circuit boards and circuit boards assemblies“ (see 91/1605/RQ, 91/1591/Q).
91/1591/Q 144 kB