International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 R. TaubePPUB2017-052024

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1268/RR PDF file 82 kB
2015-06-12 
1CD
91/1285/CD PDF file 690 kB
2015-07-032015-06
ACDV
91/1334A/CC Word file 119 kB
PDF file 135 kB
2016-01-082015-10
CCDV
91/1386/CDV
PDF file 906 kB
2016-10-072016-05
PRVC
2016-12-302016-12
APUB
91/1429/RVC PDF file 165 kB
Word file 113 kB
2017-02-032017-08
TPUB
2017-02-092017-08
DECPUB
2017-02-092017-03
RPUB
2017-03-032017-03
BPUB
2017-04-182017-05
PPUB
2017-05-232017-05
  

Abstract

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.

Project

IEC 61191-2:2017 ED3

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies