International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 1 Walter HUCKPPUB2010-032021

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/645/NP PDF file 293 kB
2007-02-02 
ANW
91/709/RVN PDF file 148 kB
2007-08-242007-06
1CD
91/777/CD PDF file 277 kB
2008-07-042008-02
ACDV
91/849/CC PDF file 142 kB
2009-02-202008-11
CCDV
91/856/CDV PDF file 206 kB
PDF file 227 kB
2009-03-062009-02
CCDV
91/856F/CDV PDF file 227 kB
2009-05-01 
APUB
91/898/RVC PDF file 210 kB
2009-10-232009-11
DECPUB
2010-01-042010-03
BPUB
2010-01-132010-01
RPUB
2010-01-27 
PPUB
2010-03-162010-05
 2019-06

Abstract

IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

Project

IEC 61760-3:2010 ED1

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

 

 

Associated Documents:

91/1568/RR

PDF file 92 kB