International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Kuniaki TAKAHASHI/ Tomoya KIGAPPUB2008-122023

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/530/NP PDF file 395 kB
2005-06-24 
ANW
91/583/RVN PDF file 126 kB
2006-03-172005-11
1CD
91/614/CD PDF file 480 kB
2006-07-142006-09
ACDV
91/696/CC PDF file 116 kB
2007-06-152006-11
CCDV
91/708/CDV PDF file 788 kB
2007-08-102007-07
AFDIS
91/775/RVC PDF file 131 kB
2008-07-042008-04
DECFDIS
2008-07-292008-09
RFDIS
2008-08-052008-08
CFDIS
91/802/FDIS

2008-08-292008-10
APUB
91/825/RVD PDF file 100 kB
2008-11-042008-10
BPUB
2008-11-052008-11
PPUB
2008-11-272008-12
  

Abstract

The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Project

IEC 62137-1-3:2008 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test