International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 D. BergmanDELPUB2013-06 

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1012/RR PDF file 77 kB
2011-09-22 
CCDV
91/1015/CDV PDF file 874 kB
PDF file 5455 kB
2011-10-272011-12
AFDIS
91/1069/RVC Word file 113 kB
PDF file 124 kB
2012-11-082012-06
DECFDIS
2012-12-182013-01
RFDIS
2013-01-032013-01
CFDIS
91/1091/FDIS

2013-03-132013-03
APUB
91/1103/RVD PDF file 128 kB
2013-05-202013-05
BPUB
2013-05-212013-05
PPUB
2013-06-052013-06
DELPUB
2017-05-23 
WPUB
  

Abstract

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition:
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.

Project

IEC 61191-2:2013 ED2

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies