Electronics assembly technology
|TC 91||WG 10||PPUB|| ||2023|
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.
IEC 61189-1:1997+AMD1:2001 CSV ED1.1
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology