International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10 PPUB 2023

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2001-08-30 
RPUB
2001-08-30 
PPUB
2001-11-222001-10
  

Abstract

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.

Project

IEC 61189-1:1997+AMD1:2001 CSV ED1.1

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology