International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 Vern SolbergDELPUB2002-04 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/113/NP  
1997-02-14 
ANW
91/122/RVN  
1997-06-301997-06
ACDV
1997-10-31 
1CD
91/142/CD  
1998-06-261998-02
ACDV
91/167B/CC PDF file 33 kB
1999-02-121998-10
CCDV
91/191/CDV PDF file 887 kB
2000-05-052000-04
AFDIS
91/220/RVC PDF file 38 kB
2001-02-022001-01
DECFDIS
2001-03-162001-05
ADISSB
2001-03-30 
DECFDIS
2001-11-262001-10
RFDIS
2001-11-262001-12
CFDIS
91/278/FDIS

2001-12-142002-02
APUB
91/288/RVD PDF file 99 kB
2002-02-202002-03
BPUB
2002-02-212002-04
PPUB
2002-03-222002-04
DELPUB
2007-04-26 
  

Project

IEC 61190-1-2:2002 ED1

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

 

 

Associated Documents:

91/165/RM

PDF file 97 kB
91/137/RM

PDF file 78 kB
CA/1789/DL

PDF file 94 kB