International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 R. TaubePPUB2017-062024

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1074/RR PDF file 69 kB
2012-11-12 
1CD
91/1300/CD PDF file 306 kB
2015-09-042015-11
ACDV
91/1329A/CC Word file 110 kB
PDF file 132 kB
2015-12-112015-12
TCDV
91/1375/CDV
PDF file 357 kB
2016-10-232016-10
CCDV
2017-03-202017-03
PRVC
2017-03-222017-03
APUB
91/1435/RVC PDF file 165 kB
Word file 115 kB
2017-03-242017-11
TPUB
2017-04-212017-11
DECPUB
2017-04-212017-06
RPUB
2017-04-272017-05
BPUB
2017-05-152017-07
PPUB
2017-05-302017-06
  

Project

IEC 61191-3:2017 ED2

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

 

Remark:

Target date of CCDV changed to 2017-01 based on decision taken at TC 91 meeting in Frankfurt, Germany 2016-10-14.

 

Associated Documents:

SMB/5690A/DL

PDF file 432 kB
SMB/5617/DL

PDF file 449 kB
SMB/5436/DL

PDF file 237 kB