International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Kaichi TsurutaPPUB2015-012022

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1021/RR PDF file 78 kB
2011-11-22 
1CD
91/1072/CD PDF file 280 kB
2012-11-082012-06
ACDV
91/1114/CC Word file 91 kB
PDF file 50 kB
2013-07-192013-03
CCDV
91/1123/CDV
PDF file 218 kB
PDF file 233 kB
2013-10-022013-09
AFDIS
91/1180/RVC Word file 101 kB
PDF file 54 kB
2014-03-212014-04
DECFDIS
2014-08-012014-06
RFDIS
2014-08-072014-08
CFDIS
91/1212/FDIS

2014-09-262014-11
APUB
91/1225/RVD PDF file 54 kB
2014-12-082014-11
BPUB
2014-12-092014-12
PPUB
2015-01-082015-01
  

Project

IEC 61189-5-4:2015 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies