International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 Ken-ichi IKEDAPPUB2009-022020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/670/NP PDF file 268 kB
2007-04-13 
ANW
91/710/RVN PDF file 113 kB
2007-08-242007-08
CCDV
91/671/CDV PDF file 241 kB
2007-08-25 
AFDIS
91/787/RVC PDF file 177 kB
2008-08-012007-12
DECFDIS
2008-09-302008-08
RFDIS
2008-10-072008-10
CFDIS
91/827/FDIS

2008-11-142008-12
APUB
91/842/RVD PDF file 38 kB
2009-01-212009-01
BPUB
2009-01-222009-01
PPUB
2009-02-112009-02
  

Project

IEC 61249-2-31:2009 ED1

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad