International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91PT 61190 Kaichi TSURUTACAN2007-04 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/378/NP PDF file 269 kB
2003-03-07 
ANW
91/422/RVN PDF file 98 kB
2003-08-292003-07
ANW
91/422A/RVN PDF file 99 kB
2003-10-03 
PWI
2005-02-102004-05
CAN
2007-10-30 
  

Project

IEC 61190-1-6 ED1

Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications

 

 

Associated Documents:

SMB/2995A/DL

PDF file 139 kB