International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Hiroshi OHSHIMADELPUB2006-05 

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/320/MCR PDF file 87 kB
2002-06-14 
1CD
91/381/CD PDF file 234 kB
2003-03-142002-11
ACDV
91/434/CC PDF file 147 kB
2003-10-312003-07
ACDV
91/434A/CC PDF file 199 kB
2004-02-27 
CCDV
91/446/CDV PDF file 200 kB
2004-03-122004-03
AFDIS
91/490/RVC PDF file 148 kB
2004-09-242004-11
DECFDIS
2005-09-212004-12
RFDIS
2005-09-292005-10
CFDIS
91/576/FDIS
2006-01-132005-12
APUB
91/587/RVD PDF file 175 kB
2006-03-212006-03
BPUB
2006-03-222006-04
PPUB
2006-04-272006-05
DELPUB
2017-03-07 
WPUB
  

Abstract

IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).

Project

IEC 60068-2-54:2006 ED2

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method