TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | Mr Hyun Ho Kim | CD | 2023-10 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2020-01-22 | |||||
| PNW |
| 2020-01-24 | ||||
| PRVN | 2020-04-17 | 2020-04 | ||||
| ACD |
| 2020-09-18 | 2021-10 | |||
| ACD |
| 2020-09-18 | 2021-10 | |||
| CD |
| 2020-12-08 | 2021-10 | |||
| PCC | 2021-02 | |||||
656 kB
150 kBProject
IEC 61189-2-808 ED1
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method