TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Mr Yoshiharu Kariya | ACD | 2022-04 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2018-02-08 | |||||
| PNW |
| 2018-02-09 | ||||
| PRVN | 2018-05-04 | 2018-05 | ||||
| ACD |
| 2018-09-14 | 2019-12 | |||
| CD | 2021-12 | |||||
141 kBProject
IEC 63215-4 ED1
Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices
Remark:
91/1685/DL - CD: 2021-12.
Hiroshi Nishikawa is the co-project leader (91/1536/DL).
Associated Documents:
91/1685/DL
764 kB