TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Mr Hiroshi Nishikawa | PCC | 2022-04 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2017-12-07 | |||||
| PNW |
| 2018-02-02 | ||||
| PRVN | 2018-04-27 | 2018-04 | ||||
| ACD |
| 2018-09-14 | 2019-12 | |||
| CD |
| 2020-07-17 | 2020-08 | |||
| PCC | 2020-10-09 | 2020-10 | ||||
| 2021-06 | ||||||
142 kBProject
IEC 63215-2 ED1
Endurance test methods for die attach materials applied to power electronics devices – Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices
Remark:
Target date for next stage after PCC changed to 2021-06 (91/1685/DL).
Mr Hiroshi Nishikawa is the co-project leader (91/1536/DL).
Associated Documents:
91/1685/DL
764 kB