International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 1 WPUB2008-09 

History

Stage
Document
Downloads
Decision Date
Target Date
CDPAS
91/767/PAS PDF file 389 kB
2008-05-09 
APUB
91/783/RVD PDF file 171 kB
2008-07-142008-08
DECPUB
2008-08-142008-07
BPUB
2008-08-15 
PPUB
2008-09-08 
WPUB
91/1240/RR PDF file 21 kB
2015-01-09 
  

Abstract

IEC/PAS 62588:2008(E) applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This document describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This document also applies to 2nd level terminal materials for bumped die that are used for direct board attach. IEC/PAS 62588:2008(E) also applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This document documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This document applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs).

Project

IEC PAS 62588:2008 ED1

Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes

 

 

Associated Documents:

91/773/INF

PDF file 108 kB
91/770/INF

PDF file 80 kB