International Standards and Conformity Assessment for all electrical, electronic and related technologies
Electronics assembly technology
|TC 91||D. Bergman||WPUB|| |
Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect, Micro Ball Grid Array, Micro Surface Mount Technology and Slightly Larger than Integrated Circuit Carrier.
IEC PAS 62084:1998 ED1
Implementation of flip chip and chip scale technology