International Standards and Conformity Assessment for all electrical, electronic and related technologies
Electronics assembly technology
|TC 91||WPUB|| |
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.
IEC 60249-3-1:1981 ED2
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
Revised By - IEC 60249-3-1 ED3